TM11R-5M2-88 : 1 μm tin copper plating on dip portion, nickel plating is 0.5 μm nickel underplating, and four directions ground plate(Discontinued).
TM11R-5M2-88(01) : Changed plating on DIP portion to flash gold from TM11R-5M2-88
TM11R-5M2-88(02) : Change nickel plating thickness to 1.27 μm or more from TM11R-5M2-88(Discontinued).
TM11R-5M2-88(04) : TM11R-5M2-88 without ground spring on printed circuit board side(Discontinued).
TM11R-5M2-88(70) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88
TM11R-5M2-88(72) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88(02)
TM11R-5M2-88(74) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88(04)
TM11R-5M2-88(01) : Changed plating on DIP portion to flash gold from TM11R-5M2-88
TM11R-5M2-88(02) : Change nickel plating thickness to 1.27 μm or more from TM11R-5M2-88(Discontinued).
TM11R-5M2-88(04) : TM11R-5M2-88 without ground spring on printed circuit board side(Discontinued).
TM11R-5M2-88(70) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88
TM11R-5M2-88(72) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88(02)
TM11R-5M2-88(74) : Changed plating on DIP portion to Tin plating from TM11R-5M2-88(04)
Was this article helpful?
That’s Great!
Thank you for your feedback
Sorry! We couldn't be helpful
Thank you for your feedback
Feedback sent
We appreciate your effort and will try to fix the article